DustPhotonics Expands Silicon Photonics Portfolio with New 2xFR4 Products

DustPhotonics has announced the expansion of its silicon photonics portfolio with the introduction of the Tamar200 and Tamar Photonic Integrated Circuits (PICs), announced in a press release. These new products are designed to enhance performance, density, and power efficiency in AI workloads and hyperscale data centers.

The Tamar200 is noted as the industry's first merchant 1.6T-2xFR4 PIC, supporting two transmit channels of 800G-FR4, with each optical lane operating at 200Gb/s per lane. Similarly, the Tamar PIC offers two transmit channels of 400G-FR4, operating at 100Gb/s per lane. Both products feature a low-loss athermal integrated multiplexer and DustPhotonics' proprietary low-loss Mach-Zehnder Modulator technology, which eliminates the need for a Thermoelectric Cooler, thereby improving system efficiency.

These PICs are designed for use in high-density modules such as OSFP and can be applied in fully retimed (DSP), Linear Pluggable Optics (LPO), and Linear Receive Optics (LRO) applications, with a reach of up to 2km. The chips will be available for sampling later this month and will be showcased at the OFC Trade Show in San Francisco from April 1-3, 2025.