OpenLight and TFC Partner to Enhance Silicon Photonics Production

OpenLight has announced a new partnership with Suzhou TFC Optical Communication Co., Ltd. (TFC) to advance the silicon photonics back-end process, announced in a press release. This collaboration aims to streamline the back-end procedure of wafer processing to Fiber Array Unit (FAU) subassembly for optical engines, optimizing the supply chain and enabling faster time-to-market at a lower cost.

The partnership combines OpenLight's expertise in custom PASIC chip design with TFC's capabilities in optical sub-assembly integrated solutions and optoelectronic package manufacturing. This collaboration will provide a comprehensive solution to meet the growing demand for optical interconnects in data center AI/ML and LiDAR and sensing markets.

OpenLight will support TFC's development by providing back-end processes such as wafer-level bumping, testing, grinding, and dicing to deliver known-good dies. This partnership will allow customers to scale manufacturing efficiently, offering a one-stop shop to streamline the supply chain and enhance the adoption of silicon photonics technology.