E&R Engineering to Showcase Advanced Packaging and CPO Technologies at ISIG 2026

April 16, 2026
E&R Engineering will present its latest semiconductor process technologies, including Advanced Packaging, Co-Packaged Optics, and Through-Glass Via innovations, at the ISIG Symposium in Sunnyvale, California, on April 20–21, 2026.

E&R Engineering Corp. will highlight its semiconductor process innovations at the International Semiconductor Industry Group (ISIG) Symposium in Sunnyvale, California, on April 20–21, 2026, announced in a press release.

The company will present technologies focused on Advanced Packaging and Co-Packaged Optics (CPO) for high-performance computing and AI applications. Key demonstrations will include specialized plasma cleaning and laser processes designed to optimize optical interconnects and heterogeneous integration.

E&R will also showcase its Fan-Out Panel Level Packaging (FOPLP) solutions for large panels, offering laser marking, cutting, plasma cleaning, and warpage control up to 16 mm. Additional highlights include Through-Glass Via (TGV) capabilities for high-density interconnects and its Automation Integration Service (AIS), which combines multiple process modules into unified systems.

With service hubs in Phoenix, Arizona, and Hillsboro, Oregon, E&R continues to expand its North American operations, aiming to strengthen local support and integration with the U.S. semiconductor supply chain.

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