MIT Technology Review and Financial Times Launch Joint AI Newsletter

November 04, 2025
MIT Technology Review and the Financial Times have partnered to publish The State of AI, a six-part newsletter series launching November 3, offering joint reporting on global AI issues including geopolitics, energy, and privacy.

MIT Technology Review and Financial Times have formed a strategic editorial partnership to examine the global impact of artificial intelligence, announced in a press release. The collaboration will produce The State of AI, a six-part newsletter series launching on November 3.

The weekly series will feature joint reporting from both publications’ journalists, covering topics such as the technological competition between the United States and China, AI’s environmental and ethical implications, and its effects on privacy, warfare, and the economy. Each edition will focus on a specific frontier of AI, including energy, defense, and global markets.

Contributors include reporters and editors from both organizations, such as MIT Technology Review’s Will Douglas Heaven and the Financial Times’ Tim Bradshaw. The newsletter will be available every Monday to subscribers on both TechnologyReview.com and FT.com, with highlights also accessible through MIT Technology Review’s complimentary AI newsletter, The Algorithm.

We hope you enjoyed this article.

Consider subscribing to one of our newsletters like Enterprise AI Brief or Daily AI Brief.

Also, consider following us on social media:

Subscribe to Enterprise AI Brief

Weekly report on AI business applications, enterprise software releases, automation tools, and industry implementations.

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more