Greenshoe Raises $3M to Launch AI Platform for SEC Disclosures
Greenshoe has raised $3 million in seed funding to launch its AI-native platform that automates the preparation and review of U.S. Securities and Exchange Commission (SEC) disclosures. The round was led by AIX Ventures, with participation from Hearst Level Up Ventures, Blueprint FTC, Service Provider Capital, and several angel investors.
The Chicago-based company said the funding will support engineering and market expansion as it brings its commercial platform to public companies. Greenshoe’s system replaces manual, fragmented disclosure workflows with an autonomous AI that drafts, validates, and reviews filings such as 10-Ks, 10-Qs, and 8-Ks in real time.
The platform integrates regulatory precedent, market comparables, and live company data to generate compliance-grade filings. It also performs real-time compliance checks, analyzes SEC comments, and benchmarks peer disclosures. According to the company, early adopters have reported time savings of up to 90% for certain reporting tasks.
Greenshoe’s architecture combines retrieval-augmented generation with structured reasoning and domain-specific benchmarking to handle complex document processing. The system continuously refines its models through feedback and evaluation loops, improving disclosure accuracy and consistency over time.
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Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
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