BYD Expands In House Automotive Chip Production With Xuanji A3
DIGITIMES Intelligence stated in an announcement that BYD has expanded its semiconductor operations from power control devices to processors for smart driving systems. The company’s Xuanji A3 system on chip has entered scaled production using a 4 nm automotive process.
BYD began developing chips more than 20 years ago, initially focusing on power control chips for electric vehicles. Its work now covers IGBT and silicon carbide power devices as well as processors for driver assistance and cockpit systems.
The company handles chip design, wafer fabrication and deployment through its own fabrication plants and semiconductor engineering team. DIGITIMES Intelligence said the same capabilities could support BYD’s work in robotics, which uses related processors, sensors, motors, batteries and control systems.
We hope you enjoyed this article
Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.
Also, consider following us on social media:
More from Data Centers
Oct 24 Ron Wyden proposes data center tax and AI worker aid Oct 24 Amazon Says AWS Cloud Capacity Is Largely Sold Out Through 2027 Oct 23 Cambricon Sales Miss Forecast Amid AI Chip Supply Constraints Oct 23 Neysa Plans 9,000 GPU Deployment at STTGDC Noida Facility Oct 23 Google Cloud introduces Agent Compute Engine for AI agentsSilicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
Market report
2025 Generative AI in Professional Services Report
Thomson Reuters
This report by Thomson Reuters explores the integration and impact of generative AI technologies, such as ChatGPT and Microsoft Copilot, within the professional services sector. It highlights the growing adoption of GenAI tools across industries like legal, tax, accounting, and government, and discusses the challenges and opportunities these technologies present. The report also examines professionals' perceptions of GenAI and the need for strategic integration to maximize its value.
Read moreYou may also like
Cambricon Sales Miss Forecast Amid AI Chip Supply Constraints
Ubitium raises $14 million for universal physical AI processor
GM Uses AI to Target Two Year Vehicle Development
NVIDIA Expands Chip Packaging and Testing Capacity
Samsung Electro-Mechanics and NVIDIA Partner on ABF Substrate Supply
Daily AI Brief: the AI news that matters, in your inbox.