Boyd Delivers 5 Million Liquid Cold Plates for AI Cooling

September 10, 2025
Boyd has announced the delivery of five million liquid cold plates to hyperscalers, enhancing AI data center cooling technology, according to BusinessWire.
Boyd Delivers 5 Million Liquid Cold Plates for AI Cooling

Boyd has announced the delivery of five million liquid cold plates to hyperscalers, a significant milestone in advancing AI data center cooling technology, according to BusinessWire. These liquid cold plates are essential for cooling modern AI processors, including GPUs and CPUs, by removing heat efficiently.

Boyd's liquid cold plates are designed to maximize cooling capacity through complex internal surface areas. They are connected to manifolds with quick disconnects, forming a liquid cooling loop that is custom-designed to cool multiple processors on a board. This design ensures high performance and reliability, crucial for hyperscaler, colocation, and enterprise data centers.

The company manufactures these cooling solutions at scale in its global facilities, with regional availability in North America, Europe, and Asia Pacific. This strategic distribution minimizes time-to-market and logistics costs for customers, ensuring efficient delivery and installation of cooling systems.

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