Ansys Certifies Thermal and Multiphysics Solutions for Intel 18A Process

Ansys Certifies Thermal and Multiphysics Solutions for Intel 18A Process

Ansys has announced the certification of its thermal and multiphysics solutions for Intel's 18A process technology, enhancing the design of advanced semiconductor systems.

Ansys has certified its thermal and multiphysics solutions for Intel's 18A process technology, announced in a press release. This certification includes Ansys RedHawk-SC and Totem power integrity signoff platforms, as well as Ansys HFSS-IC Pro electromagnetic simulation software.

The collaboration between Ansys and Intel Corporation aims to deliver a comprehensive multiphysics signoff flow for Intel Foundry's Embedded Multi-Die Interconnect Bridge (EMIB) technology. This includes the RedHawk-SC Electrothermal signoff platform and SIwave package electromagnetics simulation software for signal integrity signoff.

Ansys has also joined the Intel Foundry Chiplet Alliance to support the development of a secure ecosystem for designing multi-die heterogeneous systems. The certification process for Ansys tools is ongoing for the Intel 18A high-performance process node, with customers able to request the latest Intel PDK for early design work.

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