CoAsia SEMI and Rebellions Collaborate on AI Chiplet Development

July 28, 2025
CoAsia SEMI and Rebellions have announced a partnership to develop next-generation AI chiplets based on the REBEL architecture, with plans for large-scale production by 2026.

CoAsia SEMI and Rebellions have announced a collaboration to develop next-generation AI chiplets based on the REBEL architecture, announced in a press release. The partnership aims to complete development and verification by the end of 2026, with plans for large-scale production to supply both domestic and global AI data centers.

The collaboration involves the integration of CoAsia SEMI's advanced packaging technologies, including 2.5D silicon interposer and manufacturing capabilities, with Rebellions' AI semiconductor expertise. This joint effort is expected to enhance design flexibility, yield, and optimization in power and performance, making it a core technology for AI and HPC servers in data centers.

The agreement also includes participation from global OSAT and IP leaders, aiming to establish a comprehensive ecosystem for the global AI semiconductor market. The companies plan to expand their reach into major markets such as the United States, Europe, and Japan, leveraging a full semiconductor value chain that encompasses fabless design, packaging, OSAT, and IP.

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