Smartkem and Manz Asia Collaborate on AI Chip Packaging

Smartkem has announced a collaboration with Manz Asia to develop advanced computer and AI chip packaging solutions, as stated in a press release. The collaboration will be demonstrated at SEMICON SEA 2025 in Singapore from May 20-22, 2025.

The partnership focuses on using Smartkem's inkjet printable dielectric layers in conjunction with Manz Asia's advanced inkjet metallization technology. This combination aims to address the growing demand for AI-driven complex servers by enabling large area panel chip packaging, which surpasses the limitations of traditional 300mm wafer packaging.

Smartkem's Chairman and CEO, Ian Jenks, highlighted the market potential for panel level packaging, which is expected to grow significantly by 2030. Manz Asia's General Manager, Robert Lin, emphasized the company's commitment to green manufacturing and the advantages of their maskless inkjet technology, which supports a variety of substrates and formats.

The collaboration leverages Smartkem's UV curable dielectric layer chemistry and Manz Asia's inkjet-based semiconductor production equipment to create scalable and sustainable solutions for semiconductor advanced packaging.