SK hynix Breaks Ground on Indiana HBM Facility

August 27, 2026
SK hynix held a groundbreaking ceremony for a $4 billion HBM advanced packaging facility in Indiana, with mass production planned for the second half of 2029.

SK hynix announced in a press release that it held a groundbreaking ceremony for an advanced packaging facility for AI memory in West Lafayette, Indiana, on Aug. 27. The facility will be the company's first U.S. production hub for High Bandwidth Memory, with total expected investment of over $4 billion.

The site is scheduled to open its cleanroom by October 2028 and begin mass production of next generation HBM in the second half of 2029. SK hynix expects the site to employ about 1,000 people during commercial operations.

An Advanced Packaging R&D Testbed will be built alongside the production lines. SK hynix said the testbed will support work with customers, universities, and business partners on packaging technologies, including prototype fabrication and performance validation.

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