SK hynix Unveils AI-NAND Storage Lineup at OCP 2025

October 28, 2025
SK hynix introduced its new AIN (AI-NAND) Family of storage products at the 2025 Open Compute Project Global Summit in San Jose, designed to enhance performance, density, and bandwidth for AI workloads.

SK hynix announced its next-generation NAND storage product strategy at the 2025 Open Compute Project (OCP) Global Summit in San Jose, California, according to a press release.

The company introduced the AIN (AI-NAND) Family, a lineup of NAND-based solution products optimized for AI applications. The lineup includes AIN P (Performance), AIN D (Density), and AIN B (Bandwidth). AIN P is engineered for efficient processing of large data volumes, AIN D focuses on high-density storage with low power consumption, and AIN B expands bandwidth through vertically stacked NAND configurations.

SK hynix stated that it plans to collaborate closely with customers and partners to strengthen its position in the next-generation NAND storage market.

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