SEMIFIVE and Mobilint Sign Robotics AI Chip Contract

Oct 1, 2026
SEMIFIVE signed a turnkey contract with Mobilint to develop an AI chip for robotics under a South Korean government program. The chip will process vision and sensor data locally for applications including agricultural robots.
SEMIFIVE and Mobilint Sign Robotics AI Chip Contract

SEMIFIVE and Mobilint signed a turnkey contract to develop an AI chip for robotics, SEMIFIVE announced in a press release. The project is part of a program funded by South Korea's Ministry of Trade, Industry and Resources.

The chip will perform AI processing without relying on external servers. It is intended for applications such as agricultural robots, where it will process vision and sensor data in real time under varying outdoor conditions.

SEMIFIVE will handle detailed design, packaging, testing and mass production based on Mobilint's performance targets and specifications. The chip will include LPDDR6 memory, PCIe Gen6 and the UCIe-S chiplet interface.

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