Qualcomm and MediaTek Expand Rivalry into Cloud AI Chips
Qualcomm Technologies and MediaTek are extending their competitive landscape from smartphones to the burgeoning cloud AI ASIC market. This strategic shift was announced at COMPUTEX 2025, where both companies revealed their plans to join Nvidia's NVLink Fusion consortium, aiming to strengthen their foothold in high-performance computing.
MediaTek is leveraging its speed and partnerships, utilizing Arm reference designs and TSMC's advanced nodes to push into cloud AI ASICs. The company has demonstrated its 224G SerDes technology, highlighting its interconnect capabilities and partnerships with Nvidia and Google.
On the other hand, Qualcomm is focusing on integration and depth. Since acquiring Nuvia in 2021, Qualcomm has developed its Oryon CPU and expanded its technology stack with the acquisition of Alphawave. The company is enhancing its production flexibility with dual foundry options and preparing chips for large language model training and inference.
This rivalry in cloud AI chips could redefine the competitive landscape in AI hardware, with both companies poised to leverage their strengths in speed and integration to capture market share.
We hope you enjoyed this article.
Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.
Also, consider following us on social media:
More from: Data Centers
Subscribe to Silicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
Market report
AI’s Time-to-Market Quagmire: Why Enterprises Struggle to Scale AI Innovation
The 2025 AI Governance Benchmark Report by ModelOp provides insights from 100 senior AI and data leaders across various industries, highlighting the challenges enterprises face in scaling AI initiatives. The report emphasizes the importance of AI governance and automation in overcoming fragmented systems and inconsistent practices, showcasing how early adoption correlates with faster deployment and stronger ROI.
Read more