NEO Semiconductor Launches NEO.AI Memory Platform for AI Chips

August 05, 2026
NEO Semiconductor launched NEO.AI, a memory platform combining X-SRAM and 3D X-DRAM to address AI cache and HBM capacity limits.

NEO Semiconductor announced in a press release the launch of NEO.AI, a memory platform for artificial intelligence systems. The platform combines X-SRAM for AI cache and 3D X-DRAM for high bandwidth memory capacity.

The company says X-SRAM can deliver up to 5 times higher on chip memory density than conventional SRAM while remaining compatible with standard nanosheet logic processes. NEO Semiconductor says 3D X-DRAM can deliver up to 10 times higher memory capacity than conventional DRAM by using 3D NAND manufacturing processes.

NEO Semiconductor founder and CEO Andy Hsu is scheduled to present the platform on August 5 at FMS: The Future of Memory and Storage in Santa Clara, California. The event runs from August 4 to 6, 2026.

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