LG Electronics and Midea Highlight Advanced HVAC and Cooling Systems at AHR Expo 2026
At the AHR Expo 2026 in Las Vegas, LG Electronics and Midea Building Technologies presented their latest heating, ventilation, and air conditioning (HVAC) systems and cooling technologies for residential, commercial, and industrial sectors, announced in a press release.
LG Electronics showcased a wide range of high-efficiency HVAC products, including residential unitary systems, inverter rooftop units, and scalable commercial solutions such as the AI-powered Multi V i variable refrigerant flow system. The company also introduced a modular inverter scroll heat pump chiller and liquid cooling solutions like coolant distribution units (CDUs) and cold plates for AI data centers. Additionally, LG displayed new core components, including advanced compressors, EC fans, and BLDC motors developed with proprietary technologies.
Midea Building Technologies featured its “Smart in One” integrated building solutions, including the MagBoost Apex Pro magnetic bearing centrifugal chiller, designed for high efficiency and durability. The company also presented data center thermal management systems and its Midea iBUILDING platform, which connects HVAC and building systems under a unified digital framework for predictive maintenance and energy optimization.
Both companies used AHR Expo 2026 to demonstrate innovations aimed at improving energy efficiency, operational reliability, and intelligent system integration across diverse building applications.
We hope you enjoyed this article
Consider subscribing to one of our newsletters like Enterprise AI Brief, Silicon Brief or Daily AI Brief.
Also, consider following us on social media:
More from Enterprise
Sep 29 OpenAI Launches Dots Agents in ChatGPT Sep 29 Omnissa Details Elara Governance Controls for AI and IT Actions Sep 29 GeoIntelX Adds 100 Years of SEG Research to GIX Sep 29 Relativity Adds KPMG and Three Law Firms to claiR Program Sep 29 Yellow.ai Launches Nexus EDGE Desktop Agent for Employee SupportMore from Data Centers
Sep 29 Efficient Computer Raises $97 Million to Scale Its Processors Sep 29 Hikvision Adds HIKO AI Engine to Hik-Connect 7 Sep 29 Compal to Show NVIDIA AI Factory Infrastructure at OCP Summit Sep 29 Samsung Invests $1 Billion in KKR's Helix Data Center Platform Sep 29 Cerebras to Supply 100 Megawatts of AI Systems to Gimlet LabsEnterprise AI Brief
Weekly report on AI business applications, enterprise software releases, automation tools, and industry implementations.
Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
Read moreYou may also like
Huawei Unveils Grid Interactive AI Data Center Solution
Huawei Shows AI Energy Systems at IDEE 2026
Clivet Debuts Magnetic Levitation Cooling Portfolio for AI Data Centers
Compal to Show NVIDIA AI Factory Infrastructure at OCP Summit
Huawei presents grid interactive AI data center solution in Shanghai
Daily AI Brief: the AI news that matters, in your inbox.