Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems

February 08, 2026
Semidynamics has introduced its 3nm AI inference silicon and a vertically integrated stack covering chips, boards, and rack-scale systems for next-generation data centers.

Semidynamics has unveiled its 3nm AI inference silicon and full-stack infrastructure, marking its expansion into vertically integrated AI systems announced in a press release. The company’s roadmap includes chips, boards, and rack-level systems designed to support large-scale AI inference workloads in advanced data centers.

The new architecture introduces a memory subsystem aimed at reducing bandwidth bottlenecks and improving efficiency for high-concurrency AI applications. Semidynamics achieved silicon readiness at the 3nm node with TSMC in December 2025, confirming its transition toward production-grade silicon.

The company’s vertically integrated offering includes the 3nm AI inference silicon, boards, and racks for multi-accelerator AI platforms. Partnerships supporting the initiative include EuroHPC Joint Undertaking, HPE, Bull (Atos Group), Telefónica, Multiverse Computing, E4 Computer Engineering, and Megware, each contributing to system design, deployment, and optimization.

Founded in 2016 and headquartered in Barcelona, Semidynamics focuses on developing high-performance silicon and infrastructure solutions for AI and HPC workloads.

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