NovoLINC Launches MaxLINC Thermal Material for AI Chips

Sep 17, 2026
NovoLINC has launched MaxLINC, a thermal interface material for high power AI chips that offers thermal resistance as low as 0.7 mm²•K/W.

NovoLINC announced in a press release the launch of MaxLINC, a thermal interface material for high power AI chips. The company reports thermal resistance as low as 0.7 mm²•K/W and cooling energy savings of more than 20% for AI servers compared with current phase change materials and thermal grease products.

MaxLINC uses a nanostructured composite architecture and supports heat flux above 100 W/cm². It accommodates device and package warpage up to 350 µm and can be used between chips, cold plates, package heat spreaders and packaged devices.

Samples are available for customer qualification. NovoLINC is also expanding into a facility in Sharpsburg, Pennsylvania, to increase manufacturing, testing and research capacity.

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