Delta Develops Power and Cooling Infrastructure for NVIDIA DSX AI Factories

Sep 17, 2026
Delta Electronics is developing integrated power and cooling infrastructure for AI factories based on NVIDIA DSX, including 800 VDC power delivery and liquid cooling systems.

Delta Electronics announced in a press release, through its Americas subsidiary, that it is developing integrated power and cooling infrastructure for AI factories based on NVIDIA DSX. The architecture connects onsite energy storage, solid state transformers, medium voltage equipment, 800 VDC power delivery and liquid cooling.

Delta says its 800 VDC architecture reduces power conversion stages and delivers efficiency of up to 98%. Its power racks can supply up to 800 kW, while board level technology converts power to 50 VDC or 12 VDC with peak efficiency of up to 98.5%.

The thermal systems include 2.4 MW and 3 MW liquid cooling distribution units and cooling equipment installed within racks. Delta is also developing a prefabricated modular data center system that combines 800 VDC power equipment with 3 MW of liquid cooling capacity in factory assembled and tested infrastructure blocks.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.

Also, consider following us on social media:

AI Chips & Datacenters AI Brief AI Brief (X)
Free newsletter

Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.

Guide
AI interconnect and networking startups

AI interconnect and networking startups

29 private startups developing the chips, optical switches and memory fabrics that move data through AI infrastructure.

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.