Compal Opens Daxi AI Server Manufacturing Center

Aug 11, 2026
Compal Electronics opened its Daxi AI Server Manufacturing Center in Taoyuan, Taiwan. The site will produce AI server systems and rack solutions, with revenue contribution expected to begin in the fourth quarter of 2026.
Compal Opens Daxi AI Server Manufacturing Center

Compal Electronics opened its Daxi AI Server Manufacturing Center in Taoyuan, Taiwan, the company announced in a press release. The facility adds manufacturing capacity for AI server systems and rack solutions.

Compal said it invested NT$4.03 billion in the Daxi site, including property acquisition, facility upgrades, and manufacturing equipment. The facility covers about 7,654 square meters of land and has about 21,706 square meters of floor area.

The site will focus on AI server systems, labeled L10, and rack solutions, labeled L11. Compal expects the facility to begin contributing revenue progressively in the fourth quarter of 2026.

Compal said the Daxi center will double its AI server system production capacity and add rack manufacturing capabilities. The facility will use the company’s liquid cooling technology and will complement its production sites in Taiwan, Vietnam, and the United States.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Silicon Brief, Industrial AI Weekly or Daily AI Brief.

Also, consider following us on social media:

AI Chips & Datacenters AI Brief AI Brief (X)
Free newsletter

Industrial AI Weekly

The latest advancements in smart manufacturing, predictive maintenance, AI-driven quality control, supply chain & more.

Guide
AI accounts payable and spend tools

AI accounts payable and spend tools

AI products for invoices, payables and spend

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.