Ansys and TSMC Enhance AI-Assisted Semiconductor Design

Ansys has announced an enhanced collaboration with TSMC to advance AI-assisted workflows for semiconductor design, including new certifications for its solutions, announced in a press release. The collaboration focuses on optimizing 3D integrated circuit (3D-IC) design and accelerating market readiness for AI and high-performance computing (HPC) chip applications.

Key advancements include the certification of Ansys' RedHawk-SC, RedHawk-SC Electrothermal, and Totem platforms for TSMC's A16 process, which features a Super Power Rail for enhanced power delivery. Additionally, Ansys' HFSS-IC Pro system-on-chip electromagnetic solution is certified for TSMC's 5nm and 3nm processes, supporting the design of next-generation semiconductor products.

The partnership also extends to AI-assisted workflows for photonic integrated circuits (PICs) and radio frequency (RF) design migration. Ansys and TSMC are refining the COUPE design solutions and enhancing RF migration flows with AI technology, ensuring improved design optimization and performance.

This collaboration underscores Ansys' commitment to advancing semiconductor design technologies and empowering customers to meet the demands of complex applications, including AI, HPC, 5G/6G communications, and automotive electronics.