GlobalFoundries Plans FDX Fusion Chip Platform in Dresden

Oct 9, 2026
GlobalFoundries plans to develop and manufacture its FDX Fusion chip platform in Dresden. A €1.1 billion expansion will raise the site's annual capacity to more than one million 300 mm wafers by the end of 2028.

GlobalFoundries announced in a press release that it plans to develop and manufacture its FDX Fusion chip platform at its Dresden site. The company also marked the topping out of its €1.1 billion SPRINT expansion project.

The expansion will increase annual capacity at the site to more than one million 300 mm wafers by the end of 2028. The Dresden facility currently has capacity for up to 950,000 wafers a year, depending on the product mix.

FDX Fusion will use fully depleted silicon on insulator technology for physical AI applications. GlobalFoundries says the platform will combine digital performance comparable to 7 nm technology with analog, mixed signal, embedded memory, and radio frequency capabilities. Development through the planned IPCEI Advanced Semiconductor Technologies program remains subject to German federal approval.

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