xFusion Showcases Liquid Cooling and 800V Power Systems at OCP 2026

Oct 14, 2026
xFusion presents liquid cooled racks, an 800V power prototype and a super node architecture for dense AI infrastructure at OCP 2026.

xFusion said in a press release that it is presenting liquid cooled racks, high voltage power systems and optical interconnect technology at the 2026 Open Compute Project Global Summit in San Jose. The event runs from October 12 to 15.

The FusionPod for AI V8 is a 42U modular rack that supports up to 155 kW and uses direct liquid cooling. Its cold plate design uses diamond and copper composite materials and supports more than 4,000 watts of cooling capacity per chip.

xFusion is also showing an 800V HVDC Sidecar prototype designed for configurations from 300 kW to 1.2 MW. Its DaYu 2.0 Super Node supports up to 240 kW per rack, with 128 XPUs in one cabinet or 256 XPUs across two cabinets, and can use processors from multiple vendors.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.

Also, consider following us on social media:

AI Chips & Datacenters AI Brief AI Brief (X)
Free newsletter

Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.

AI Token Webinar

Market report

2025 Generative AI in Professional Services Report

Thomson Reuters

This report by Thomson Reuters explores the integration and impact of generative AI technologies, such as ChatGPT and Microsoft Copilot, within the professional services sector. It highlights the growing adoption of GenAI tools across industries like legal, tax, accounting, and government, and discusses the challenges and opportunities these technologies present. The report also examines professionals' perceptions of GenAI and the need for strategic integration to maximize its value.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.