Synopsys and Samsung Collaborate on AI and Multi-Die Design

Synopsys has announced a collaboration with Samsung Foundry to enhance AI and multi-die design innovation using advanced processes. The partnership aims to accelerate design turnaround and improve power, performance, and area (PPA) for next-generation technologies.

Synopsys has announced its collaboration with Samsung Foundry to advance AI and multi-die design innovation on Samsung's cutting-edge processes. Announced in a press release, this partnership focuses on accelerating design turnaround and enhancing power, performance, and area (PPA) for next-generation technologies.

The collaboration has already resulted in the successful tape-out of a High Bandwidth Memory (HBM) customer design using Synopsys' 3DIC Compiler and Samsung's I-CubeS technology. This achievement significantly reduced turnaround time and improved design reliability. Additionally, Synopsys has introduced certified AI-driven digital and analog flows on Samsung's SF2P process, which are designed to expedite the development of high-performance designs.

Synopsys' broad portfolio of IP, including 224G, UCIe, MIPI, and LPDDR6, is optimized for Samsung's SF2P and SF4X processes, providing a low-risk path to silicon success. This collaboration aims to support a wide range of applications, from high-performance computing to ultra-efficient edge AI devices.

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