Skymizer and VIA NEXT Partner on AI Inference and Chiplet Integration

May 26, 2026
Skymizer and VIA NEXT Technologies have announced a collaboration to advance AI inference infrastructure and chiplet integration, focusing on system-level validation, advanced packaging, and modular architectures for enterprise-scale AI deployments.

Skymizer and VIA NEXT Technologies announced in a press release a strategic collaboration to advance AI inference infrastructure and chiplet integration. The partnership combines Skymizer's HyperThought LPU platform with VIA NEXT's expertise in semiconductor system design and advanced packaging.

The collaboration focuses on several areas including AI inference infrastructure architecture research, advanced packaging, and chiplet integration technology. It also covers HyperThought LPU IP evaluation at advanced process nodes, development of engineering and design validation boards, and system-level validation for AI inference accelerators.

Skymizer will contribute its compiler-driven hardware and software co-design capabilities, while VIA NEXT will provide system integration and chiplet implementation expertise. The companies aim to create scalable and modular architectures that support enterprise and on-premise AI inference deployments.

Skymizer plans to showcase its latest inference technologies, including the HTX301 ultra-large model inference platform, during COMPUTEX 2026 in Taipei.

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