SEMI Projects 300mm Fab Equipment Spending to Reach $227 Billion in 2029

Oct 14, 2026
Global spending on equipment for 300mm chip fabs is projected to rise 31% to $149 billion in 2026 and reach $227 billion in 2029, according to SEMI.

SEMI projects global spending on front end equipment for 300mm chip fabs will rise 31% from a year earlier to $149 billion in 2026, the association said in a press release. Spending is expected to grow at double digit rates through 2029, when it will reach $227 billion.

SEMI expects construction to begin on 20 new 300mm fabs or production lines worldwide in 2026 and 18 in 2027, excluding facilities used solely for research and development. Three projects are expected to begin construction in the United States in 2026, followed by four in 2027.

Global construction spending across 300mm facilities is projected to rise 23% to $47.5 billion in 2026 and 33% to $63.3 billion in 2027, before reaching $68.4 billion in 2028. Equipment spending in the Americas is forecast to increase from $18.1 billion in 2026 to $40.6 billion in 2029.

The projections come from the 3Q26 edition of SEMI's 300mm Fab Outlook, which the semiconductor industry association sells to subscribers through its market intelligence team.

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