Kulicke & Soffa wins SEMI award for fluxless chip bonding

Oct 14, 2026
Kulicke & Soffa received the 2026 SEMI Award for North America for its fluxless thermocompression bonding technology.

Kulicke & Soffa received the 2026 SEMI Award for North America for its formic acid in situ bonding technology, the company said in a press release. SEMI presented the award during the CEO Summit Keynotes at SEMICON West.

The fluxless thermocompression bonding process combines plasma cleaning with in situ formic acid oxide reduction. It supports interconnect pitches below 10 microns across wafer level, substrate level and panel level manufacturing.

The process avoids the flux cleaning required after traditional thermocompression bonding. Kulicke & Soffa includes the technology in its advanced packaging portfolio, including the APTURA platform, for applications in AI, high performance computing and photonics.

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