Cadence and Samsung Foundry Expand Collaboration for AI and Automotive Solutions

Cadence Design Systems has expanded its collaboration with Samsung Foundry, including a new multi-year IP agreement to enhance AI-driven design solutions for advanced process nodes. Announced in a press release, the collaboration focuses on developing advanced AI-driven flows on Samsung's latest SF2P and other advanced process nodes.

The partnership aims to deliver high-performance, low-power solutions for AI data centers, automotive applications, including advanced driver-assistance systems (ADAS), and next-generation RF connectivity. Cadence's AI-driven design solutions and comprehensive portfolio of IP and silicon solutions are set to enhance designers' productivity and accelerate time to market for leading-edge SoCs, chiplets, and 3D-ICs on Samsung Foundry's advanced processes.

The expanded IP agreement includes advanced memory and interface IP solutions targeting AI, high-performance computing (HPC), and automotive applications. This includes a comprehensive range of technologies such as LPDDR6/5x, GDDR7, DDR5, PCI Express, and Universal Chiplet Interconnect Express, among others, enabling a complete subsystem silicon solution.

Additionally, Cadence and Samsung are collaborating on digital full flow certification and advanced digital technology developments, including analog design migration and RF chip/package co-design reference flow collaboration. These efforts are aimed at improving power integrity and enhancing thermal and warpage analyses for 3D-ICs using GPU acceleration.