Cadence and Samsung Foundry Expand Collaboration for AI and Automotive Solutions

Cadence and Samsung Foundry Expand Collaboration for AI and Automotive Solutions

Cadence has expanded its collaboration with Samsung Foundry, including a new multi-year IP agreement to enhance AI-driven design solutions for advanced process nodes.

Cadence Design Systems has expanded its collaboration with Samsung Foundry, including a new multi-year IP agreement to enhance AI-driven design solutions for advanced process nodes. Announced in a press release, the collaboration focuses on developing advanced AI-driven flows on Samsung's latest SF2P and other advanced process nodes.

The partnership aims to deliver high-performance, low-power solutions for AI data centers, automotive applications, including advanced driver-assistance systems (ADAS), and next-generation RF connectivity. Cadence's AI-driven design solutions and comprehensive portfolio of IP and silicon solutions are set to enhance designers' productivity and accelerate time to market for leading-edge SoCs, chiplets, and 3D-ICs on Samsung Foundry's advanced processes.

The expanded IP agreement includes advanced memory and interface IP solutions targeting AI, high-performance computing (HPC), and automotive applications. This includes a comprehensive range of technologies such as LPDDR6/5x, GDDR7, DDR5, PCI Express, and Universal Chiplet Interconnect Express, among others, enabling a complete subsystem silicon solution.

Additionally, Cadence and Samsung are collaborating on digital full flow certification and advanced digital technology developments, including analog design migration and RF chip/package co-design reference flow collaboration. These efforts are aimed at improving power integrity and enhancing thermal and warpage analyses for 3D-ICs using GPU acceleration.

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