YPlasma Shows Fanless Solid State Cooling for NVIDIA Jetson at Computex 2026

YPlasma announced in a press release at Computex 2026 in Taipei the successful integration of its dielectric barrier discharge plasma cooling module on the NVIDIA Jetson Orin Nano platform. The module replaces rotary fans with a 200 micrometer flexible actuator film that generates ionic wind to cool the device, creating forced convection without moving parts, noise, or dust intake.

The company described the solution as the first public demonstration of fanless cooling for a widely used edge AI compute module. The system operates across a thermal range of 7 to 25 watts, achieving steady state in 10 minutes, and fits within a 6 millimeter Z-height. The actuator draws less than one watt of power and operates below 20 decibels, consistent with the performance demonstrated on YPlasma’s noiseless laptop shown at CES 2026.

Developed at YPlasma’s facilities in Newark, New Jersey, and Madrid, Spain, the cooling architecture is designed for sealed enclosures used in industrial, automotive, and outdoor edge deployments. The company stated that it is engaging with partners across multiple sectors including autonomous driving, telecom, drones, and industrial power electronics.

YPlasma is exhibiting the Jetson cooling system at Booth I0601 in Hall 1 of TaiNEX 1 during Computex 2026 and is a finalist in the InnoVEX 2026 Pitch Contest.