UfiSpace demonstrates liquid cooling for 1.6T AI networking

Oct 14, 2026
UfiSpace is demonstrating a liquid cooled 102.4 Tbps networking platform with 64 ports supporting 1.6T connectivity at the 2026 OCP Global Summit.

UfiSpace said in a press release that it is demonstrating a liquid cooled 1.6T AI networking platform at the 2026 Global Summit from the Open Compute Project Foundation. The live demonstration runs from October 12 to 15 in San Jose, California.

The S9331-64HO3L provides 102.4 Tbps of switching capacity through 64 1.6T OSFP ports. The 2OU ORv3 platform uses a Broadcom Tomahawk 6 chip and operates with a cooling distribution unit to test its thermal and mechanical design under active conditions.

UfiSpace is also showing the S9331-64HO, a 3RU air cooled platform with 102.4 Tbps of capacity. Its other systems include the S9630-32HO router with 51.2 Tbps capacity, 32GB of packet buffering and 32 1.6T ports, along with the S9620-32E router offering 25.6 Tbps and 32 800G interfaces.

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