LITEON Shows 800 VDC Power and Cooling Systems for NVIDIA Vera Rubin

Oct 14, 2026
LITEON Technology is displaying 800 VDC power distribution and liquid cooling systems for NVIDIA Vera Rubin and OCP ORv3 infrastructure at the 2026 OCP Global Summit.

LITEON Technology is displaying an 800 VDC power and cooling portfolio for AI data centers at the 2026 OCP Global Summit, the company said in a press release. The event runs from October 12 to 15 in San Jose, California.

For the NVIDIA Vera Rubin NVL72 platform, LITEON is showing a 95 kW DC/DC power shelf and a 280 kW liquid to liquid cooling distribution unit. The system combines 800 VDC distribution, backup power and thermal management using the NVIDIA MGX architecture.

The company is also presenting a 2.6 MW cooling distribution unit from DCX Liquid Cooling Systems, plus an OCP ORv3 power rack with a 180 kW power shelf and a 108 kW capacitor backup unit. Its component portfolio covers conversion from 800 VDC rack distribution to voltage regulation at the GPU.

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