Keysight and Intel Foundry Collaborate on EMIB-T Technology for AI and Data Centers

Keysight Technologies and Intel Foundry have announced a collaboration to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, aimed at advancing high-performance packaging solutions for AI and data center markets. This collaboration, announced in a press release, focuses on improving communication between chiplets and 3DICs, which is crucial for handling the growing complexity of AI and data center workloads.

The partnership supports the latest interconnect standards, including Universal Chiplet Interconnect Express™ 2.0 and Open Compute Project Bunch of Wires, enhancing design flexibility and reducing development costs. Keysight's Chiplet PHY Designer now offers advanced simulation capabilities for these standards, enabling pre-silicon level validation and streamlining the path to tapeout.

This initiative is part of a broader effort to create a chiplet interoperability ecosystem, which aims to accelerate innovation and ensure reliable high-speed data transfer and efficient power delivery in next-generation semiconductor applications.