Great Lakes Semiconductor Starts ChipForge Vehicle Sensor Project

Oct 14, 2026
Great Lakes Semiconductor has started the first project on its Great American ChipForge platform, focused on intelligent sensors for vehicle applications.

Great Lakes Semiconductor launches the first project on its Great American ChipForge platform, focused on intelligent sensors for vehicle applications, as announced in a press release. The project is part of the company's Innovation Funnel initiative and combines chip design, modular wafer fabrication, packaging and testing.

The project involves Neitas and Daikin for modular fabrication equipment, BlueDot Ventures for sensor devices, FMC for ferroelectric memory, Altascient for predictive planning and Advanced Printed Electronic Solutions for package design. APES will develop an additively manufactured substrate that combines GLS and FMC semiconductors with multiple BlueDot sensors.

The planned package will include GLS power management and low power RISC-V processor chips, FMC memory and BlueDot sensor technologies. GLS plans to use its FINPAT facilities to manufacture the packaged devices and support configurable prototypes based on the same processes, design rules and materials.

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