Compal and ZutaCore Unveil Waterless Cooling for AI Data Centers

September 10, 2025
Compal and ZutaCore have introduced a waterless, two-phase liquid cooling solution for AI data centers, showcased at Yotta 2025.

Compal Electronics and ZutaCore have introduced a groundbreaking waterless, two-phase liquid cooling solution for AI data centers, announced in a press release. This innovative technology, showcased at Yotta 2025, aims to enhance efficiency, reliability, and sustainability in handling next-generation AI workloads.

The collaboration features ZutaCore's HyperCool platform, which uses a non-conductive, non-corrosive dielectric fluid to instantly remove heat at the source, ensuring processors remain cool even in constrained environments. This approach eliminates the risks associated with traditional water-based systems, such as condensation and corrosion, while maximizing performance and reducing energy costs.

Compal's platforms, integrated with ZutaCore's cooling technology, include the SG720-2A-L2 and SD221-8A-L2 systems. These platforms are designed for high-density computing and AI acceleration, achieving impressive Power Usage Effectiveness (PUE) and partial PUE (pPUE) scores, which are industry benchmarks for energy efficiency. The systems support both current and future data center infrastructures, ensuring compatibility and sustainability.

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