Agentic AI Foundation Sets AGNTCon and MCPCon Japan 2026 Schedule
Agentic AI Foundation, hosted by the Linux Foundation, announced in a press release the schedule for AGNTCon + MCPCon Japan 2026, set for September 10 and 11, 2026, at Belle Salle Shibuya Garden in Tokyo.
The technical program will cover standards, infrastructure, security, and governance for AI agents used in production. Speakers and participants will include representatives from SoftBank Group Corp., Hitachi, NTT, Google, Microsoft Corporation, and Anthropic, among others.
Sessions will focus on reliable agent systems, links to tools and enterprise data, coordination across agents, and operation under real world constraints. Keynote sessions and technical tracks will address system design, evaluation before production, governance, observability, security, and enterprise deployment.
Listed highlights include Designing Trustworthy Agent Systems, Building the Open Agentic Stack, and Evaluating Agents Before Production. The program includes nine tracks, with topics such as reliable agent systems, distributed agent systems, and agentic engineering.
We hope you enjoyed this article.
Consider subscribing to one of our newsletters like Daily AI Brief.
Also, consider following us on social media:
Subscribe to Daily AI Brief
Daily report covering major AI developments and industry news, with both top stories and complete market updates
Market report
Superagency in the Workplace: Empowering People to Unlock AI’s Full Potential
This report explores the transformative potential of artificial intelligence in the workplace, emphasizing the readiness of employees versus the slower adaptation of leadership. It highlights the significant productivity growth potential AI offers, akin to historical technological shifts, and discusses the barriers to achieving AI maturity within organizations. The report also examines the role of leadership in steering companies towards effective AI integration and the need for strategic investments to harness AI's full capabilities.
Read more